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| Master (outer) case gross weight | 989.98 g |
|---|---|
| Random write (4KB) | 78000 IOPS |
| Master (outer) case width | 135.9 mm |
| Hot-Plug support | Yes |
| Master (outer) case length | 203.2 mm |
| H/W PLP function | Yes |
| Use conditions | Server/Enterprise |
| TBW rating | 3504 |
| Target workload | Mixed Use (MU) |
| Hardware encryption | No |
| Memory type | 3D TLC NAND |
| Master (outer) case height | 69.8 mm |
| Weight | 69 g |
| Data transfer rate | 6 Gbit/s |
| Package width | 129.5 mm |
| Write speed | 530 MB/s |
| Products per master (outer) case | 10 pc(s) |
| SSD capacity | 1.92 TB |
| Package height | 184.2 mm |
| Non-operating vibration | 20 G |
| Width | 69.8 mm |
| Depth | 100.1 mm |
| Component for | Server/workstation |
| Power consumption (average) | 1.45 W |
| Read speed | 560 MB/s |
| Operating temperature (T-T) | 0 - 70 °C |
| Package weight | 91.2 g |
| Read latency | 200 µs |
| Operating vibration | 2.17 G |
| Mean time between failures (MTBF) | 2000000 h |
| Height | 7 mm |
| Interface | Serial ATA III |
| Write latency | 30 µs |
| Power consumption (write) | 3.6 W |
| SSD form factor | 2.5" |
| Package depth | 9.14 mm |
| Power consumption (idle) | 1.3 W |
| Storage temperature (T-T) | -40 - 85 °C |
| Random read (4KB) | 94000 IOPS |
| Power consumption (read) | 1.6 W |
| Warnings | Protect from moisture and extreme temperatures. |
| Warnings | Do not open the appliance casing, risk of damage. |
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