On-Die ECC | Yes |
---|---|
Warnings | Do not disassemble by yourself. |
Warnings | Protect against moisture. |
Memory voltage | 1.1 |
Module configuration | 2048M x 64 |
Refresh row cycle time | 295 ns |
Package depth | 14 mm |
Package height | 171.4 mm |
Height | 30 mm |
Package weight | 46.21 g |
Width | 3.8 mm |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Internal memory | 32 GB |
Depth | 69.6 mm |
Memory data transfer rate | 4800 MT/s |
Lead plating | Gold |
Storage temperature (T-T) | -55 - 100 °C |
JEDEC standard | Yes |
Row active time | 29.12 ns |
ECC | No |
Memory form factor | 262-pin SO-DIMM |
Package width | 95.2 mm |
Weight | 16.8 g |
CAS latency | 38 |
Intel Extreme Memory Profile (XMP) | Yes |
Component for | Laptop |
Operating temperature (T-T) | 0 - 85 °C |
Memory layout (modules x size) | 2 x 16 GB |
Row cycle time | 48 ns |
Programming power voltage (VPP) | 1.8 V |
SPD profile | Yes |
Buffered memory type | Unregistered (unbuffered) |
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