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| On-Die ECC | Yes |
|---|---|
| Warnings | Do not disassemble by yourself. |
| Warnings | Protect against moisture. |
| Memory voltage | 1.1 |
| Module configuration | 2048M x 64 |
| Refresh row cycle time | 295 ns |
| Package depth | 14 mm |
| Package height | 171.4 mm |
| Height | 30 mm |
| Package weight | 46.21 g |
| Width | 3.8 mm |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Internal memory | 32 GB |
| Depth | 69.6 mm |
| Memory data transfer rate | 4800 MT/s |
| Lead plating | Gold |
| Storage temperature (T-T) | -55 - 100 °C |
| JEDEC standard | Yes |
| Row active time | 29.12 ns |
| ECC | No |
| Memory form factor | 262-pin SO-DIMM |
| Package width | 95.2 mm |
| Weight | 16.8 g |
| CAS latency | 38 |
| Intel Extreme Memory Profile (XMP) | Yes |
| Component for | Laptop |
| Operating temperature (T-T) | 0 - 85 °C |
| Memory layout (modules x size) | 2 x 16 GB |
| Row cycle time | 48 ns |
| Programming power voltage (VPP) | 1.8 V |
| SPD profile | Yes |
| Buffered memory type | Unregistered (unbuffered) |
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